发明名称 METHOD OF DEFINING POLY-SILICON GROWTH DIRECTION
摘要 The present invention provides a method of defining poly-silicon growth direction, comprising: providing a glass substrate (1); forming a buffer layer (3) on the glass substrate (1); forming a metal film layer (5) on the buffer layer (3); implementing etching to the metal film layer (5) to form a metal film array (51); covering the buffer layer (3) with a high-purity quartz mask (7); forming a graphene layer (9) on the high-purity quartz mask (7) and the metal film array (51); implementing etching to the graphene layer (9) to form a graphene layer array (91); forming an amorphous silicon thin film (2) on the buffer layer (3); implementing high temperature dehydrogenation to the amorphous silicon thin film (2); implementing an Excimer laser anneal process to the amorphous silicon thin film (2); melted amorphous silicon is re-crystallized.
申请公布号 US2016240377(A1) 申请公布日期 2016.08.18
申请号 US201414381933 申请日期 2014.07.14
申请人 SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. 发明人 YU Wei;WANG Yewen;LEE Yungjui
分类号 H01L21/02 主分类号 H01L21/02
代理机构 代理人
主权项 1. A method of defining poly-silicon growth direction, comprising steps of: step 1, providing a glass substrate and cleaning the glass substrate; step 2, forming a buffer layer on the glass substrate; step 3, forming a metal film layer on the buffer layer; step 4, implementing etching to the metal film layer with an acid liquid to form a metal film array; step 5, covering an area of the buffer layer outside the metal film array with a high-purity quartz mask to expose the metal film array; step 6, forming a graphene layer on the high-purity quartz mask and the metal film array; step 7, implementing etching to the graphene layer to form a graphene layer array coinciding with the metal film array of the fourth step; step 8, forming an amorphous silicon thin film on the buffer layer having the metal film array and the graphene layer array; step 9, implementing high temperature dehydrogenation to the amorphous silicon thin film; step 10, implementing an Excimer laser anneal process to the amorphous silicon thin film, and the amorphous silicon thin film melts after absorbing the energy of the laser and temperature rising; step 11, melted amorphous silicon is re-crystallized and starts growing and becomes larger from a low temperature area comprising the metal film array and the graphene layer array toward high temperature areas around to form poly-silicon.
地址 Guangdong CN