| 主权项 |
1. A sealant composition for an electronic device comprising:
(a) a compound having two or more (meth)acryloyl groups selected from the group consisting of: hexanediol dimethacrylate, hydroxyacryloyloxypropyl methacrylate, hexanediol diacrylate, urethane acrylate, epoxy acrylate, bisphenol A-type epoxy acrylate, modified epoxy acrylate, fatty acid-modified epoxy acrylate, amine-modified bisphenol A-type epoxy acrylate, allyl methacrylate, ethylene glycol dimethacrylate, diethylene glycol dimethacrylate, ethoxylated bisphenol A dimethacrylate, tricyclodecane dimethanol dimethacrylate, glycerine dimethacrylate, polypropylene glycol diacrylate, propoxylated ethoxylated bisphenol A diacrylate, 9,9-bis(4-(2-acryloyloxyethoxy)phenyl)fluorene, tricyclodecane diacrylate, dipropylene glycol diacrylate, polypropylene glycol diacrylate, propoxylated neopentyl glycol diacrylate, tricyclodecane dimethanol diacrylate, 1,12-dodecanediol dimethacrylate, trimethylolpropane trimethacrylate, dipentaerythtol polyacrylate, dipentaerythtol hexaacrylate, trimethylolpropane triacrylate, trimethylolpropane ethoxytriacrylate, polyether triacrylate, glycerine propoxy triacrylate, pentaerythritol tetraacrylate, pentaerythritolethoxy tetraacrylate, ditrimethylol propane tetraacrylate, monopentaerythritol acrylate, dipentaerythritol acrylate, tripentaerythritol acrylate, polypentaerythritol acrylate, and pentaerythritol triacrylate, (b) 1-20% by weight of a bismaleimide, and (c) a nitroxide compound and/or a thiocarbonylthio compound. |
