| 摘要 |
<p>PROBLEM TO BE SOLVED: To make it possible to reuse a wiring substrate when a semiconductor pellet is defective in a semiconductor device having the structure, wherein the semiconductor pellet and the wiring substrate are bonded with resin. SOLUTION: A semiconductor pellet 1 having bump electrodes 3 and a wiring substrate 4 having pad electrodes 6 are made to face, and the bump electrodes 3 and the pad electrodes 6 are overlapped. The pressure contact state between the respective electrodes 3 and 6 is maintained, and the semiconductor pellet 1 and the wiring substrate 4 are bonded with bonding resin. In this substrate device, the above described bonding resin comprises a temporary fixing resin 8 which links a part of the semiconductor pellet 1 to the wiring substrate 4, and main fixing resin 12 which bonds the remaining part other than the bonding part by the temporary fixing resin 8 between the semiconductor pellet 1 and the wiring substrate 4.</p> |
