| 摘要 |
PROBLEM TO BE SOLVED: To make operational reliability for heat superior while size-expansion of a device and an increase in manufacturing cost are repressed in an electronic control device. SOLUTION: By mounting a drive element 5 (5a and 5b) and a control process element 3 onto separate boards 9 and 11 different from each other, heat generated from the drive element 5 is hard to reach the control process element 3, and an influence of the heat upon the control process element 3 is suppressed. Furthermore, by imagining that there is a virtual flat surface S vertical to a bottom 7b of a box body, where the driving circuit board 11 is provided and placing the control process element 3 and the drive element 5 with the flat surface S in between, transmission of heat from the drive element 5 to the control process element 3 is suppressed further.
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