| 摘要 |
PROBLEM TO BE SOLVED: To provide a die bonding apparatus for introducing automation for mounting electronic components to a metal stem. SOLUTION: In the die bonding apparatus 1, if a stem 2 which has generated displacement is mounted to a stem mounting head 6, an electronic component S cannot be mounted accurately on a component mounting surface 27. Therefore, a structure is configured so that the stem mounting head 6 can be rotated freely with an axial line M passing the center of the stem mounting surface 27 defined as a rotating axial line. Therefore, a stem base itself 24 is rotated under the condition that the stem base 24 is arranged on the stem mounting surface 44, the displacement of the stem base 24 is thereby corrected on the stem mounting head 6, and, as a result, the component mounting surface 27 of the stem base 24 can be oriented to the desired position with higher accuracy. Accordingly, the mounting of the electronic component S by a bonding nozzle 17 on the component mounting surface 27 can be achieved accurately. COPYRIGHT: (C)2003,JPO
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