| 摘要 |
PURPOSE:To assure stable and high quality of the titled device eliminating the fear of bonding wire breakdown due to vibration of silicon base resin by a method wherein a protective coated film circuit substrate is cleaned by ultrasonic waves. CONSTITUTION:A semiconductor pellet 2 is bonded on a specified part on a film circuit substrate 1 while the semiconductor pellet 2 and a conductor 4 on the film circuit substrate 1 are connected with each other using a lead wire 5 by wire-bonding process protective-coating the semiconductor pellet 2 with a phenol resin 6. A capacitor 7 is solder-connected to a specified part on the film circuit substrate 1 using flux 9 while the substrate 1 is immersed in organic solvent and after removing the flux by impressing ultrasonic waves for cleaning, the film circuit substrate 1 is dried up. The phenol resin with high hardness is utilized as a protective coating agent to mask the ultrasonic wave impression feasible in case of cleaning flux by organic solvent eliminating any residual chlorine content in the flux further assuring stable and high quality of the titled device. |
