发明名称 |
Molding die set |
摘要 |
A molding die set includes a first molding die which comprises cavities and a parting surface; a second molding die which comprises cavities and a parting surface arranged to face the first molding die; and an O-ring supported on the first molding die to surround the cavities and to have a peripheral line which does not extend outwardly from the parting surface.
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申请公布号 |
US6491508(B1) |
申请公布日期 |
2002.12.10 |
申请号 |
US20000689760 |
申请日期 |
2000.10.13 |
申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
KUROSAWA SHIN;SUGAI AKIRA |
分类号 |
H01L21/56;B29C33/10;B29C33/20;B29C33/44;B29C45/14;B29C45/34;B29C45/40;B29C45/64;(IPC1-7):B29C70/72 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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