发明名称 Molding die set
摘要 A molding die set includes a first molding die which comprises cavities and a parting surface; a second molding die which comprises cavities and a parting surface arranged to face the first molding die; and an O-ring supported on the first molding die to surround the cavities and to have a peripheral line which does not extend outwardly from the parting surface.
申请公布号 US6491508(B1) 申请公布日期 2002.12.10
申请号 US20000689760 申请日期 2000.10.13
申请人 OKI ELECTRIC INDUSTRY CO., LTD. 发明人 KUROSAWA SHIN;SUGAI AKIRA
分类号 H01L21/56;B29C33/10;B29C33/20;B29C33/44;B29C45/14;B29C45/34;B29C45/40;B29C45/64;(IPC1-7):B29C70/72 主分类号 H01L21/56
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