| 摘要 |
<p>PURPOSE:To enable to facilitate positioning of a semiconductor wafer with a hairline of scriber by a method wherein line patterns having the prescribed breadth and being recognizable to be discriminated optically from the circumferential material are provided at the center parts of the cutting off regions of the semiconductor wafer. CONSTITUTION:After Al is adhered on an Si substrate 1 interposing an Si oxide film 2 between them, it is converted into an alumina film 3 excepting the parts to constitute conductive paths, and when it is to be divided into elements next, the pattern lines 5 having breadth of 10mum or less being possible to be discriminated optically from the circumferential material of Al, etc., is provided at the center parts of the cutting regions 4. Accordingly positioning with the hairline of scriber is simplified, and precision of positioning is also enhanced.</p> |
