| 摘要 |
PURPOSE:To raise a heat dissipation efficiency by forming a heat dissipation through hole of a low thermal resistor connected with the surfaces of a die attach unit and an IC package. CONSTITUTION:A window hole 17 for containing an IC chip 16 is opened at the center by pressing, heat dissipation through holes 19 connected with die attach unit 14 are opened at both sides, the holes 19 are buried by printing with a material having preferable thermal conductivity such as tungsten, and a conductor pattern 20 is radially formed on the upper surface. When an IC package containing the chip 16 is mounted on an electronic circuit substrate to perform a logic operation. Then, the heat generated from the chip 16 is dissipated from the dia attach unit 14 through heat dissipation through holes 9, 23 to the surface of the package via low thermal resistance thermal conductivity passage, conducted through the unit 14 to the first insulating layer 13, the second insulating layer 15 and the third insulating layer 21 and dissipated from the surface of the IC package. |
