发明名称 パルス幅変調電力制御を用いた局所プラズマ処理方法及びその装置
摘要 PROBLEM TO BE SOLVED: To provide s method of local plasma processing with use of pulse width modulation power control and an apparatus therefor, capable of efficiently and accurately processing the surface of a processed object with numerical control by controlling the local plasma processing efficiency on the surface of processed object at high speed, for processing such as machining, deposition, or modification by scanning the surface of processed object with stably generated local plasma.SOLUTION: A locally generated high-frequency plasma P is scanned on the surface of a processed object 2 at a constant velocity. At the same time, the local plasma processing efficiency on the surface of processed object is changed by the pulse width modulation (PWM) power control for changing the ratio between ON time (t1) and OFF time (t2) of high frequency plasma, on the basis of the NC processing data including the positional information and the processing amount preset for each minimum processing region on the surface of processed object, so that a predetermined region of the surface of processed object is processed with numerical control.
申请公布号 JP6048886(B2) 申请公布日期 2016.12.21
申请号 JP20130052219 申请日期 2013.03.14
申请人 国立大学法人大阪大学 发明人 山村 和也;佐野 泰久
分类号 C23F4/00;H01L21/3065 主分类号 C23F4/00
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