WAFER PROCESSING METHOD

摘要

A wafer is divided into device chips each of which is surrounded by a mold resin. The wafer has a plurality of devices arranged like a matrix with a spacing having a predetermined width, the front side of each device being covered with the mold resin, the spacing being filled with the mold resin to form a street between any adjacent ones of the devices. The wafer processing method includes a division start point forming step of forming a division start point along each street at the lateral center of the mold resin filling the spacing and a dividing step of applying an external force to the wafer after performing the division start point forming step, thereby laterally dividing each street into two parts at the division start point to obtain the device chips divided from each other, each device chip being surrounded by the mold resin.

主权项

1. A wafer processing method for dividing a wafer into device chips each of which is surrounded by a mold resin, said wafer having a plurality of devices arranged like a matrix with a spacing having a predetermined width, the front side of each device being covered with said mold resin, said spacing being filled with said mold resin to form a street between any adjacent ones of said devices, said wafer processing method comprising:
a division start point forming step of forming a division start point along each street at the lateral center of said mold resin filling said spacing; and a dividing step of applying an external force to said wafer after performing said division start point forming step, thereby laterally dividing each street into two parts at said division start point to obtain said device chips divided from each other, each device chip being surrounded by said mold resin.