发明名称 |
Electronic component housing with heat sink |
摘要 |
A photovoltaic assembly for converting solar radiation to electrical energy is described. The photovoltaic assembly includes a photovoltaic module and an electronic component housing. The photovoltaic module has a frame, a laminate, a plurality of solar cells and a backsheet. The electronic component housing has an upper section to couple to the backsheet, a middle section and a lower section for enclosing electronic components. The electronic components can include a microinverter or electronics for a junction box. The middle section can have a heat sink in thermal communication with the electronic component and an opening. The opening can be a plurality of openings having a plurality of air fins distributed therein, or can be a diagonal or curved structure. The opening can permit fluid communication between the heat sink and an ambient environment. The upper section and/or the aforementioned air fins can also be coupled to the backsheet via a heat conductive adhesive. |
申请公布号 |
US9635783(B2) |
申请公布日期 |
2017.04.25 |
申请号 |
US201213436723 |
申请日期 |
2012.03.30 |
申请人 |
SUNPOWER CORPORATION |
发明人 |
Kinyon Zachary;Gannon John;McKibben Nick |
分类号 |
H01L31/044;H05K7/20;H02S40/34;H01L31/00;H01L31/024;H01L31/049 |
主分类号 |
H01L31/044 |
代理机构 |
Oblon, McClelland, Maier & Neustadt, L.L.P. |
代理人 |
Oblon, McClelland, Maier & Neustadt, L.L.P. |
主权项 |
1. A photovoltaic assembly comprising:
a photovoltaic module having a front side that faces the sun during normal operation and a back side opposite the front side, the photovoltaic module comprising:
a frame of the photovoltaic module;a plurality of solar cells on the front side disposed within the photovoltaic module; anda backsheet on the back side of the photovoltaic module; and an electronic component housing comprising:
an upper portion coupled to the backsheet of the photovoltaic module;a lower portion enclosing an electronic component; anda middle portion comprising:
a heat sink in thermal communication with the electronic component, the heat sink disposed between the backsheet and the electronic component; andan opening in the electronic component housing between the upper portion and lower portion, the opening permitting fluid communication between the heat sink and an ambient environment. |
地址 |
San Jose CA US |