发明名称 Electronic component housing with heat sink
摘要 A photovoltaic assembly for converting solar radiation to electrical energy is described. The photovoltaic assembly includes a photovoltaic module and an electronic component housing. The photovoltaic module has a frame, a laminate, a plurality of solar cells and a backsheet. The electronic component housing has an upper section to couple to the backsheet, a middle section and a lower section for enclosing electronic components. The electronic components can include a microinverter or electronics for a junction box. The middle section can have a heat sink in thermal communication with the electronic component and an opening. The opening can be a plurality of openings having a plurality of air fins distributed therein, or can be a diagonal or curved structure. The opening can permit fluid communication between the heat sink and an ambient environment. The upper section and/or the aforementioned air fins can also be coupled to the backsheet via a heat conductive adhesive.
申请公布号 US9635783(B2) 申请公布日期 2017.04.25
申请号 US201213436723 申请日期 2012.03.30
申请人 SUNPOWER CORPORATION 发明人 Kinyon Zachary;Gannon John;McKibben Nick
分类号 H01L31/044;H05K7/20;H02S40/34;H01L31/00;H01L31/024;H01L31/049 主分类号 H01L31/044
代理机构 Oblon, McClelland, Maier & Neustadt, L.L.P. 代理人 Oblon, McClelland, Maier & Neustadt, L.L.P.
主权项 1. A photovoltaic assembly comprising: a photovoltaic module having a front side that faces the sun during normal operation and a back side opposite the front side, the photovoltaic module comprising: a frame of the photovoltaic module;a plurality of solar cells on the front side disposed within the photovoltaic module; anda backsheet on the back side of the photovoltaic module; and an electronic component housing comprising: an upper portion coupled to the backsheet of the photovoltaic module;a lower portion enclosing an electronic component; anda middle portion comprising: a heat sink in thermal communication with the electronic component, the heat sink disposed between the backsheet and the electronic component; andan opening in the electronic component housing between the upper portion and lower portion, the opening permitting fluid communication between the heat sink and an ambient environment.
地址 San Jose CA US