| 发明名称 | System and method for extracting components | ||
| 摘要 | A method for extracting components includes the steps of heating an electronic device having one or more components to a predetermined temperature so as to substantially weaken a bonding substance arranged to bond the one or more components to the electronic device, and thereafter manipulating the electronic device to extract the one or more components from the electronic device. | ||
| 申请公布号 | US9578795(B2) | 申请公布日期 | 2017.02.21 |
| 申请号 | US201514621876 | 申请日期 | 2015.02.13 |
| 申请人 | Li Tong (H.K.) Telecom Company Limited | 发明人 | Zhang Lei;Wang Ming-Tong |
| 分类号 | B32B38/10;H05K13/04;B23K1/018;H05K3/22;B23K1/00;B32B43/00 | 主分类号 | B32B38/10 |
| 代理机构 | Renner Kenner Greive Bobak Taylor & Weber | 代理人 | Renner Kenner Greive Bobak Taylor & Weber |
| 主权项 | 1. A system for extracting one or more components from an electronic device, the system comprising: a preheating module arranged to heat an electronic device with one or more components bounded thereto by a bonding substance to a predetermined temperature so as to substantially weaken the bonding substance a computerized controller arranged to receive layout data of the electronic device and information associated with at least one selected components to be removed from the electronic device; an extraction module comprising: an engagement mechanism arranged to engage the electronic device; anda robotic arm operably connected with and controlled by the computerized controller to automatically extract the at least one selected components from the heated electronic device based on the layout data and the information; anda conveyor system arranged to transfer the heated electronic device in single pass from the preheating module to the extraction module. | ||
| 地址 | HK | ||