| 摘要 |
A drive circuit device includes a circuit board (21) having a multilayer structure, which includes first to fourth circuit conductor layers (31a to 31d), and first to third insulating layers (32a to 32c) ; and heat sinks (22, 23) that dissipate heat of the circuit board (21) to an outside. An upper PET (12Hu) state is embedded in the first insulating layer (32a), and a lower FET (12Lu) state is embedded in the second insulating layer (32b). The upper PET (12Hu) and the lower PET (12Lu) are disposed so that a region in which the upper PET (12Hu) is positioned and a region in which the lower PET (12Lu) is positioned overlap each other in a stacking direction. A lead-out portion (41) is formed at a second circuit pattern (33b) of the circuit conductor layer (31b), the lead-out portion (41) extending from the circuit board (21) in a direction orthogonal to the stacking direction, and being connected to the heat sinks (22, 23) so that heat is transferred to the heat sinks (22,23). |
