Provided is a component mounting device in which shortening of a mounting time from the supply of a component to the mounting of the component on an object via imaging by an imaging device is possible. A component mounting machine moves a mounting head from a supply position P1 to each of mounting positions P3 and P4 of a circuit board CB via an imaging position P2. Further, the component mounting machine performs control such that the mounting head moves in a direction of movement at the time of imaging that is either of an X-axis direction or a Y-axis direction when passing through the imaging position P2. The component mounting machine determines the direction of movement at the time of imaging, according to a first X-axis distance Lx and a first Y-axis distance Ly from the imaging position P2 to each of the mounting positions P3 and P4.
