| 摘要 |
PROBLEM TO BE SOLVED: To provide a high definition and thin double-sided printed wiring board which allows for reliable formation of a solder bump, while preventing such a situation that a solder bump peels off and drops out together with a welding terminal, and also allows for highly accurate conduction test, while preventing warpage even if it is made thinner, and to provide a manufacturing method for enhancing productivity and yield, by preventing warpage in the way of manufacturing.SOLUTION: In a double-sided printed wiring board 51 where a plurality of soldering terminals 53A-C are embedded on one plate side in a substrate 52 so as to be exposed to one plate side, and a plurality of connection terminals 54A-C are embedded on the other plate side in a substrate, the soldering terminal has a surface, exposed to one plate surface side of the substrate, that is flush with the surface of the substrate. The soldering terminal is tapered so that the area of a cross section, in parallel with one plate surface of the substrate, is enlarged toward the inside of the substrate.SELECTED DRAWING: Figure 1 |
