| 发明名称 |
SEMICONDUCTOR WAFER PROTECTION FILM AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE |
| 摘要 |
According to the present invention, there is provided a semiconductor wafer protective film including a substrate layer (A) and an adhesive layer (C) formed on the substrate layer (A) , in which the substrate layer (A) includes polymer, and a solubility parameter of the polymer determined by a Van Krevelen method is equal to or greater than 9. |
| 申请公布号 |
EP3007212(A1) |
申请公布日期 |
2016.04.13 |
| 申请号 |
EP20140805148 |
申请日期 |
2014.05.22 |
| 申请人 |
MITSUI CHEMICALS TOHCELLO, INC. |
发明人 |
MORIMOTO AKIMITSU;KATAOKA MAKOTO;FUKUMOTO HIDEKI |
| 分类号 |
H01L21/304;B32B27/06;B32B27/30;C08F222/10;C09J7/02;C09J133/00;C09J133/10;H01L21/301;H01L21/683 |
主分类号 |
H01L21/304 |
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