DEVICES AND METHODS TO REDUCE STRESS IN AN ELECTRONIC DEVICE
摘要
A device includes a stress relief region between at least two stress domains of a substrate (e.g., of a semiconductor die or other integrated circuit). The stress relief region includes a conductive structure electrically coupling circuitries of the stress domains between which the conductive structure is disposed.
申请公布号
WO2016048629(A1)
申请公布日期
2016.03.31
申请号
WO2015US48597
申请日期
2015.09.04
申请人
QUALCOMM INCORPORATED
发明人
KIM, DAEIK DANIEL;LAN, JE-HSIUNG JEFFREY;YUN, CHANGHAN HOBIE;VELEZ, MARIO FRANCISCO;ZUO, CHENGJIE;KIM, JONGHAE;BERDY, DAVID FRANCIS
