| 发明名称 |
MAGNETIC LOGIC DEVICE, MAGNETIC LOGIC CIRCUIT, AND MAGNETIC MEMORY |
| 摘要 |
One embodiment provides a magnetic logic device including: a first conductive thin wire; a second conductive thin wire; and a third conductive thin wire that electrically connects the first conductive thin wire and the second conductive thin wire. The first to third conductive thin wires commonly includes: a first non-magnetic metal layer; a second non-magnetic metal layer; and a magnetic metal layer sandwiched between the first non-magnetic metal layer and the second non-magnetic metal layer. |
| 申请公布号 |
US2016087631(A1) |
申请公布日期 |
2016.03.24 |
| 申请号 |
US201514861199 |
申请日期 |
2015.09.22 |
| 申请人 |
Kabushiki Kaisha Toshiba |
发明人 |
KONDO Tsuyoshi;MORISE Hirofumi;NAKAMURA Shiho |
| 分类号 |
H03K19/00;H03K19/20;G11C11/16;H03K19/18 |
主分类号 |
H03K19/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A magnetic logic device comprising:
a first conductive thin wire; a second conductive thin wire; and a third conductive thin wire that electrically connects the first conductive thin wire and the second conductive thin wire, wherein the first to third conductive thin wires commonly includes:
a first non-magnetic metal layer;a second non-magnetic metal layer; anda magnetic metal layer sandwiched between the first non-magnetic metal layer and the second non-magnetic metal layer. |
| 地址 |
Minato-ku JP |
