发明名称 |
RESIN AND PHOTOSENSITIVE RESIN COMPOSITION |
摘要 |
The purpose of the present invention is to provide a resin that is capable of producing a photosensitive resin composition having high sensitivity and high film retention ratio. The present invention provides a resin which has a polyamide structure, a polyimide precursor structure or a polyimide structure wherein an acid having an alicyclic structure with 6-40 carbon atoms or a semi-alicyclic structure with 6-40 carbon atoms or an anhydride of the acid is contained in an amount of 5-95% by mole if the total amount of acids or anhydrides thereof is taken as 100% by mole. |
申请公布号 |
WO2016035593(A1) |
申请公布日期 |
2016.03.10 |
申请号 |
WO2015JP73687 |
申请日期 |
2015.08.24 |
申请人 |
TORAY INDUSTRIES, INC. |
发明人 |
MASUDA, YUKI;ARIMOTO, YUKARI;YUBA, TOMOYUKI |
分类号 |
C08G73/10;G03F7/023;H05K1/03;H05K3/28 |
主分类号 |
C08G73/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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