发明名称 電子部品素子およびそれを備えた複合モジュール
摘要 An electronic component element includes a piezoelectric substrate and a comb-shaped electrode located on one principal surface of the piezoelectric substrate. A support layer is arranged around the comb-shaped electrode. A cover layer is disposed so as to cover the support layer and the comb-shaped electrode. Via-hole electrodes extend through the cover layer and are connected to the comb-shaped electrode. An uneven portion is located on a principal surface of the cover layer that is opposite to a principal surface of the cover layer that is opposed to the comb-shaped electrode.
申请公布号 JP5880683(B2) 申请公布日期 2016.03.09
申请号 JP20140500152 申请日期 2013.01.28
申请人 株式会社村田製作所 发明人 竹村 忠治
分类号 H03H9/25;H01L23/02;H01L23/04;H01L23/28 主分类号 H03H9/25
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