HIGH-FREQUENCY MODULE

摘要

This high-frequency module (1) is provided with a multilayer-dielectric substrate (2) and a cutoff block (5). The multilayer-dielectric substrate (2) has a ground plane (2a), and a high-frequency electronic component (3) that has a heat-producing part is mounted to the multilayer-dielectric substrate (2) so as to be in contact with said ground plane (2a). The cutoff block (5), which comprises vertical walls (5b) and a cover section (5a) that covers same, contains the high-frequency electronic component (3) and is provided with a cavity (5c) that exhibits cutoff characteristics at the frequency of a high-frequency signal used by the high-frequency electronic component (3). The vertical walls (5b) of the cutoff block (5) are designed so as to contact the ground plane (2a) of the multilayer-dielectric substrate (2). This results in a high-frequency module (1) with improved heat-dissipation performance.