LASER PROCESSING METHOD

摘要

It comprises a first step of preparing an object; a second step of forming a modified region in a first member along a line by irradiating the first member with laser light while using a front face of the object as a laser light entrance surface; a third step of forming a processing scar in a bonding layer along the line by irradiating the bonding layer with laser light while using the front face as a laser light entrance surface; and a fourth step, after the first to third steps, of forming a modified region in a second member along the line by irradiating the second member with laser light while using a rear face of the object as a laser light entrance surface; the fourth step uses the processing scar as a reference for alignment of a laser light irradiation position with respect to the second member.

主权项

1. A laser processing method comprising:
a first step of preparing an object to be processed having first and second planar members stacked on top of each other and a bonding layer, arranged between the first and second planar members, bonding the first and second planar members to each other, the object being set with a line to process; a second step of forming a modified region in the first planar member along the line by irradiating the first planar member with laser light along the line while using a front face of the object on a side opposite from the bonding layer in the first planar member as a laser light entrance surface; a third step of forming a processing scar in the bonding layer along the line by irradiating the bonding layer with laser light along the line while using the front face of the object as a laser light entrance surface; and a fourth step, after the first to third steps, of forming a modified region in the second planar member along the line by irradiating the second planar member with laser light along the line while using a rear face of the object on a side opposite from the bonding layer in the second planar member as a laser light entrance surface; wherein the fourth step irradiates the second planar member with the laser light along the line by using the processing scar formed in the bonding layer as a reference for alignment of a laser light irradiation position with respect to the second planar member.