| 发明名称 |
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF |
| 摘要 |
There is provided a printed circuit board including: a core layer having a cavity formed therein; a heat radiation body included in the cavity; an insulating layer provided on an upper surface and a lower surface of the core layer; and a heat dissipating via penetrating through the insulating layer to be in contact with the heat radiation body and dissipating heat externally, wherein the heat radiation body includes an insulating plate, a first metal block formed on an upper surface of the insulating plate, and a second metal block formed on a lower surface of the insulating plate. |
| 申请公布号 |
US2016037620(A1) |
申请公布日期 |
2016.02.04 |
| 申请号 |
US201514668804 |
申请日期 |
2015.03.25 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KANG Myung Sam;KO Young Gwan;MIN Tae Hong;LEE Jung Han |
| 分类号 |
H05K1/02;H05K3/42;H05K3/00;H05K3/32;H05K1/11;H05K1/18 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A printed circuit board comprising:
a core layer having a cavity formed therein; a heat radiation body included in the cavity; an insulating layer provided on an upper surface and a lower surface of the core layer; and a heat dissipating via penetrating through the insulating layer to be in contact with the heat radiation body and dissipating heat externally, wherein the heat radiation body includes an insulating plate, a first metal block provided on an upper surface of the insulating plate, and a second metal block provided on a lower surface of the insulating plate. |
| 地址 |
Suwon-Si KR |
