ELECTROSTATIC CHUCK DEVICE

摘要

Provided is an electrostatic chuck device in which the attachment of particles to the rear surface of a plate-like specimen can be further suppressed by suppressing the generation source of the particles and, furthermore, an effect of cooling the plate-like specimen using a cooling gas can be improved. The electrostatic chuck device is formed by including an electrostatic chuck portion in which an upper surface (2a) of a ceramic plate-like body (2) is used as a placement surface on which a wafer is placed and an electrostatic adsorption electrode is provided inside the ceramic plate-like body (2) or on the rear surface thereof, multiple protrusions (11) are formed on the upper surface (2a), and multiple fine protrusions (13) are formed in regions (12) excluding the multiple protrusions (11) in the upper surface (2a).

主权项

1. An electrostatic chuck device formed by including an electrostatic chuck portion in which a first main surface of a ceramic plate-like body is used as a placement surface on which a plate-like specimen is placed and an electrostatic adsorption electrode is provided inside the ceramic plate-like body or on a second main surface thereof,
wherein multiple protrusions are formed on the first main surface, and multiple fine protrusions or multiple fine recesses are formed in regions excluding the multiple protrusions on the first main surface.