WAFER PACKAGING STRUCTURE AND PACKAGING METHOD

摘要

The present invention provides a wafer packaging structure and a wafer packaging method. The wafer packaging structure includes: a substrate, wherein grooves are formed in one surface of the substrate, and chips are arranged in the grooves; a material sealing layer formed on the substrate, wherein connecting components of the chips are exposed from the surface of the material sealing layer; a wiring layer formed on the material sealing layer and electrically connected with the connecting components; a protective film layer formed on the wiring layer, wherein the protective film layer is provided with openings for exposing the wiring layer; lower ball metal layers formed in the openings and connected with the wiring layer; and metal balls formed on the lower ball metal layers. The wafer packaging structure provided by the present invention can be used for packaging a plurality of chips, thereby having a higher integration level and a higher integration degree.

主权项

1. A wafer packaging structure, comprising:
a substrate, wherein grooves are formed in one surface of the substrate, and chips are arranged in the groove; a material sealing layer formed on the substrate, wherein connecting components of the chips are exposed from the surface of the material sealing layer; a wiring layer formed on the material sealing layer and electrically connected with the connecting components; a protective film layer formed on the wiring layer, wherein the protective film layer is provided with openings for exposing the wiring layer; lower ball metal layers formed in the openings and connected with the wiring layer; and metal balls formed on the lower ball metal layers.