发明名称 CHIP ON FILM MODULE, DISPLAY PANEL AND DISPLAY
摘要 The present disclosure disclosed a chip on film module of display panel, comprising: a flexible substrate, a chip arranged on the flexible substrate, and a first group of terminals, wherein, each of the first group of terminals comprises a metal bonding section with different area for contacting with a fan-out terminal of a corresponding fan-out wire of the display panel, so that the equivalent resistance on each fan-out wire is equal or approximate. The present disclosure also provides a display panel, comprising: a display unit; and a group of fan-out terminals connected with the display unit, wherein each of the fan-out terminals comprises metal bonding section with different area used for contacting with a corresponding one of the first group of terminals of a chip on film (COF) module. The present disclosure can effectively eliminate the color cast caused by the non-uniformity of the impedances on the fan-out wires.
申请公布号 US2015181701(A1) 申请公布日期 2015.06.25
申请号 US201414241713 申请日期 2014.01.17
申请人 SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. 发明人 Li Houbin
分类号 H05K1/02;H05K1/03;H05K1/18 主分类号 H05K1/02
代理机构 代理人
主权项 1. A chip on film module of display panel, comprising: a flexible substrate, a chip arranged on the flexible substrate, and a first group of terminals, arranged on the flexible substrate and electrically connected with an output end of the chip, wherein each of the first group of terminals comprises a metal bonding section with different area for contacting with a fan-out terminal of a corresponding fan-out wire of the display panel.
地址 Shenzhen CN