发明名称 |
CHIP ON FILM MODULE, DISPLAY PANEL AND DISPLAY |
摘要 |
The present disclosure disclosed a chip on film module of display panel, comprising: a flexible substrate, a chip arranged on the flexible substrate, and a first group of terminals, wherein, each of the first group of terminals comprises a metal bonding section with different area for contacting with a fan-out terminal of a corresponding fan-out wire of the display panel, so that the equivalent resistance on each fan-out wire is equal or approximate. The present disclosure also provides a display panel, comprising: a display unit; and a group of fan-out terminals connected with the display unit, wherein each of the fan-out terminals comprises metal bonding section with different area used for contacting with a corresponding one of the first group of terminals of a chip on film (COF) module. The present disclosure can effectively eliminate the color cast caused by the non-uniformity of the impedances on the fan-out wires. |
申请公布号 |
US2015181701(A1) |
申请公布日期 |
2015.06.25 |
申请号 |
US201414241713 |
申请日期 |
2014.01.17 |
申请人 |
SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
发明人 |
Li Houbin |
分类号 |
H05K1/02;H05K1/03;H05K1/18 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
1. A chip on film module of display panel, comprising:
a flexible substrate, a chip arranged on the flexible substrate, and a first group of terminals, arranged on the flexible substrate and electrically connected with an output end of the chip, wherein each of the first group of terminals comprises a metal bonding section with different area for contacting with a fan-out terminal of a corresponding fan-out wire of the display panel. |
地址 |
Shenzhen CN |