Method of producing encapsulated IC devices on a wafer

摘要

This method of waferscale packaging produces finished integrated circuits (ICs) individually completely encapsulated with environmentally protective packaging material while still in the wafer format. Following conventional semiconductor fabrication of chips at the wafer level and prior to their separation, a first polymer is applied to the front surface of the wafer with allowance for contact holes. A carrier wafer is attached to the exposed polymer. The original substrate is removed and the devices are separated by cutting through the semiconductor layer and the first polymer. A second polymer is applied to cover the exposed backside of the devices and to fill the cut spaces between them, thereby sealing the remaining five surfaces of the chips. The second polymer layer may also include contact holes for access to the back side of the device chips. A second singulation cutting leaves the chips on the wafer prepared for a pick-and-place operation.

主权项

1. A method of producing a waferscale assembly, comprising:
acquiring a wafer layer; applying a device layer to the wafer layer; developing Integrated Circuit (IC) devices within the device layer; coating the device layer with a first polymer; attaching a carrier wafer to the first polymer; removing the wafer layer; dicing the IC devices with a first series of cuts to create a space that separates each one of the IC devices from each other of the IC devices, wherein the IC devices remain attached to the carrier wafer by the first polymer; and coating the device layer with a second polymer, wherein the second polymer seamlessly combines with the first polymer and fills the space that separates the IC devices, wherein each of the IC devices is fully encapsulated by a combination of the first polymer and the second polymer.