| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor module manufacturing method which achieves a uniform thickness of a resin sheet for forming a heat radiation path to inhibit variation in heat radiation properties.SOLUTION: A semiconductor module manufacturing method comprises: a pressure bonding process of sandwiching a high heat conductivity insulating resin sheet between a seventh surface of a negative electrode and a second region of a positive electrode and applying pressure while applying heat to the high heat conductivity insulating resin sheet in opposite directions of the seventh surface and the second region to bond the seventh surface and an eighth surface of the high heat conductivity insulating resin sheet and bond a ninth surface of the high heat conductivity insulating resin sheet to the second region; and a solder reflow process of connecting each component and each element by solder reflow. |
