High performance surface mount electrical interconnect with external biased normal force loading

摘要

A surface mount electrical interconnect adapted to provide an interface between solder balls on a BGA device and a PCB. A socket substrate is provided with a first surface, a second surface, and a plurality of openings sized and configured to receive the solder balls on the BGA device. A plurality of electrically conductive contact tabs are attached to the socket substrate so that contact tips on the contact tabs extend into the openings. The contact tips electrically couple with the BGA device when the solder balls are positioned in the openings. Vias electrically couple the contact tabs to contact pads located proximate the second surface of the socket substrate. Solder balls are bonded to the contact pads to electrically and mechanically couple the electrical interconnect to the PCB.

主权项

1. A surface mount electrical interconnect forming an interface between a first set of solder balls on a BGA device and a PCB, the electrical interconnect comprising: a socket substrate comprising a first surface, a second surface, and a plurality of openings sized and configured to receive the first set of solder balls on the BGA device; a plurality of electrically conductive contact tabs attached to the socket substrate so that contact tips on the contact tabs extend into the openings an amount that permits the solder balls of the BGA device to be inserted into the openings with no resistance; a force generally parallel with the first surface of the socket substrate laterally shifting the BGA device so the contact tips engage with the first set of solder balls near an upper radii thereof proximate a second interface of the first set of solder balls with the BGA device to electrically couple the contact tabs with the BGA device and to secure the first set of solder balls in the openings; vias electrically coupling the contact tabs to contact pads located proximate the second surface of the socket substrate; and a second set of solder balls bonded to the contact pads that electrically and mechanically couple the electrical interconnect to the PCB; and wherein the electrically conductive contact tabs are attached to and extend into the openings generally parallel with the first surface of the socket substrate.