发明名称 METHOD OF FORMING LOW-K FILMS
摘要 To deposit silicon carbide into a substrate, there is introduced into a reaction zone a gas including source gas of silicon, carbon, oxygen and an inert gas. An electric field is generated using low and high frequency RF power to produce a plasma discharge in the reaction zone to cause the deposition.
申请公布号 US2005042883(A1) 申请公布日期 2005.02.24
申请号 US20030643200 申请日期 2003.08.18
申请人 GOUNDAR KAMAL KISHORE 发明人 GOUNDAR KAMAL KISHORE
分类号 C23C16/42;C23C16/32;C23C16/509;C30B25/10;C30B29/36;H01L21/205;H01L21/314;H01L21/768;H01L23/522;(IPC1-7):H01L21/44;H01L21/31;H01L21/469;H01L21/476 主分类号 C23C16/42
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