| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor device which can be made to function as an optical semiconductor device applying a surface facing a package base of a semiconductor chip to a light emitting surface or a light receiving surface, and a manufacturing method of the device. SOLUTION: On one surface 20b of a package substrate 20 composed of transparent glass, a convex part 27 of each light receiving part 14 is formed so that the optical axis passes through the light receiving part 14. In a state such that one surface 10a of a semiconductor substrate 10 is made to face the other surface 20a of the package substrate 20, the semiconductor substrate 10 is mounted on the package substrate 20. A first wiring electrode 21 of the package substrate 20 is electrically connected with a bump 13 of the semiconductor substrate 10, and the semiconductor substrate 10 and the package substrate 20 are collectively unified in a body. After that, the semiconductor substrate 10 and the package substrate 20 are cut en bloc to intersect a through-hole 25, and divided into a plurality of semiconductor chips 1 and package bases 2, thereby forming individual semiconductor devices A. |
