CONTACT DEVICE FOR POWER SEMICONDUCTOR MODULE

摘要

PROBLEM TO BE SOLVED: To provide a contact device which is constituted in a simple manner and guarantees the same characteristics over the whole service life of a power semiconductor module.

SOLUTION: The contact device for the power semiconductor module has a resilient contact element with a contacting end (18) provided for contacting with a terminal element (14) of a planar circuit carrier (12) of the power semiconductor module. The contacting end (18) is constituted in a simple manner in a rectilinear pin-shape fashion and the terminal element (14) has a chip component (10) which is formed with a center recess (16) for the contacting end (18) of the resilient contact element.

COPYRIGHT: (C)2011,JPO&INPIT