| 摘要 |
PURPOSE: A composition for eletroless chemical copper plating to form microwiring is provided to reduce a processing time by adding a stabilizer and to form microwiring. CONSTITUTION: A composition for eletroless chemical copper plating to form microwring comprises copper compound, a reducing agent, an igniting agent, a PH adjusting agent, a catalyst, a stabilizer, a promoter and surfactant. The surfactant is tetraethylammonium perfluorooctanesulphonate. The copper compound is selected from the group consisting of blue vitriol, copper nitrate, cupric chloride and formic acid copper.
|
