Printed waveguide transmission line having layers bonded by conducting and non-conducting adhesives

摘要

Three-dimensional electromagnetic signal interconnect systems and methods for fabricating the interconnect systems are described. An example apparatus may comprise a first layer including a first dielectric layer coupled to one or more of a first and second conducting layer. The first layer may also include at least one hole. The apparatus may also comprise a second layer including at least one through-hole and a second dielectric layer coupled between a third and fourth conducting layer. The apparatus may further comprise a third layer including at least one hole and a third dielectric layer coupled to one or more of a fifth and sixth conducting layer. The at least one hole/through-hole of each layer may be aligned at least in part with the at least one hole/through-hole of each other layer, and may include metal plating coupled to an inner surface of the respective at least one hole/through-hole.

主权项

1. An apparatus for a waveguide transmission line, the apparatus comprising:
a first layer comprising at least one first conducting layer coupled to a first dielectric layer; a second layer coupled to the first layer and comprising a second dielectric layer coupled between a second conducting layer and a third conducting layer, wherein the second layer includes at least one through-hole; a third layer coupled to the second layer and comprising a third dielectric layer coupled between a fourth conducting layer and a fifth conducting layer, wherein the third layer includes at least one through-hole aligned at least in part with the at least one through-hole of the second layer; a fourth layer coupled to the third layer and comprising a fourth dielectric layer coupled between a sixth conducting layer and a seventh conducting layer, wherein the fourth layer includes at least one through-hole aligned at least in part with the at least one through-holes of the second and third layers; a fifth layer coupled to the fourth layer and comprising a fifth dielectric coupled between an eighth conducting layer and a ninth conducting layer, wherein the fifth layer includes at least one through-hole aligned at least in part with the at least one through-holes of the second, third, and fourth layers; a conducting adhesive coupled to at least edges of the at least one through-hole of the second layer, wherein the conducting adhesive is configured to couple the second layer between the first layer and the third layer so as to align at least in part the at least one through-hole of the second layer with the at least one through-holes of the first layer and the third layer; and a conducting adhesive coupled to at least edges of the at least one through-hole of the fourth layer, wherein the conducting adhesive is configured to couple the fourth layer between the third layer and the fifth layer so as to align at least in part the at least one through-hole of the fourth layer with the at least one through-holes of the third layer and the fifth layer.