WIRING BOARD AND SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a wiring board and the like which can improve heat radiation property while securing insulation property.SOLUTION: A wiring board mounted by a semiconductor element or a module including the semiconductor element has: a heat sink; an insulating layer provided on the heat sink via an adhesive layer; an electric connection wire electrically connected to the semiconductor element and a heat diffusion wire not electrically connected to the semiconductor element which are provided on the insulating layer; through-wirings which are integrally formed with the heat diffusion wire and are provided on the insulating layer side of the heat diffusion wire in the way that they fill through holes going through the insulating layer in a thickness direction on a surface; an opening which is provided on the insulating layer and exposes the electric connection wire; and a reflection film provided with an opening that exposes the heat diffusion wire. On the surface where the adhesive layer of the heat sink is formed, a projection part is provided. The projection part has the same composition as the heat sink, and is placed in an area overlapping at least the through-wirings in a planar view.