发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide: a semiconductor device including a transistor using an oxide semiconductor film, in which stable electric characteristics can be provided and high reliability can be achieved; and a structure achieving high-speed response and high-speed operation in a semiconductor device.SOLUTION: A semiconductor device includes a transistor in which an oxide semiconductor film, a gate insulating film, and a gate electrode layer are stacked in order and a sidewall insulating layer is provided on the side surface of the gate electrode layer. In the semiconductor device, the sidewall insulating layer has an oxygen-excess region, and is formed in such a manner that a first insulating film is formed and then is subjected to oxygen doping treatment, a second insulating film is formed over the first insulating film, and a stacked layer of the first insulating film and the second insulating film are etched.
申请公布号 JP2015146444(A) 申请公布日期 2015.08.13
申请号 JP20150060767 申请日期 2015.03.24
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 YAMAZAKI SHUNPEI
分类号 H01L21/336;H01L21/28;H01L21/8234;H01L21/8242;H01L21/8244;H01L21/8247;H01L27/08;H01L27/088;H01L27/105;H01L27/108;H01L27/11;H01L27/115;H01L29/417;H01L29/786;H01L29/788;H01L29/792 主分类号 H01L21/336
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