| 摘要 |
<p>The present invention relates to a thermoelectric module, and provides the thermoelectric module which can prevent leakage current generated at a coupling portion when a thermoelectric semiconductor device is coupled to an electrode and inhibit a phenomenon that the heat of a heating unit is transferred to a cooling unit to enhance the performance of a thermoelectric device by forming an insulation layer having low thermal conductivity on an outer surface of the thermoelectric semiconductor device.</p> |
