ABRASIVE PARTICLES WITH MODIFIED SURFACE AND SLURRY COMPOSITION CONTAINING THE SAME

摘要

The present invention relates to abrasive particles with surfaces reformed using a polymer, and a slurry composition containing the abrasive particles. According to the present invention, the surfaces of soft abrasive particles can be reformed to manufacture a slurry composition used in chemical mechanical polishing (CMP) of a copper layer, a copper barrier, and a flexible dielectric layer. Especially, the abrasive particles with surfaces reformed according to the present invention exhibits a superior polishing rate for a cooper layer in an acidic region and inhibits the generation of dishing, corrosion, or scratch to keep the surface of a layer to be polished in an excellent state.