发明名称 BLACK TITANIUM OXYNITRIDE POWDER, AND SEMICONDUCTOR SEALING RESIN COMPOUND USING SAME
摘要 This black titanium oxynitride powder for use in a semiconductor sealing resin compound is coated by a silica film having a surface thickness of 2.5-12nm. The black titanium oxynitride powder has a volume resistivity of at least 1×105Ω·cm when in a powder compact state formed by compacting the powder at a pressure of 5MPa. Moreover, the lightness index L* value of the black titanium oxynitride powder in the CIE 1976 L*a*b* color space (measurement light source C: color temperature 6774K) is 14 or less.
申请公布号 WO2015093498(A1) 申请公布日期 2015.06.25
申请号 WO2014JP83324 申请日期 2014.12.17
申请人 MITSUBISHI MATERIALS ELECTRONIC CHEMICALS CO., LTD. 发明人 KAGEYAMA, KENSUKE;ISHIKURO, SHIGEKI
分类号 C08L63/00;C01G23/00;C08K3/28;C08K9/06;C08L101/00;H01L23/29;H01L23/31 主分类号 C08L63/00
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