| 发明名称 |
COMPUTER MODULES WITH SMALL THICKNESSES AND ASSOCIATED METHODS OF MANUFACTURING |
| 摘要 |
Computer modules with small thicknesses and associated methods of manufacturing are disclosed. In one embodiment, the computer modules can include a module substrate having a module material and an aperture extending at least partially into the module material. The computer modules can also include a microelectronic package carried by the module substrate. The microelectronic package includes a semiconductor die carried by a package substrate. At least a portion of the semiconductor die extends into the substrate material via the aperture. |
| 申请公布号 |
US2015156908(A1) |
申请公布日期 |
2015.06.04 |
| 申请号 |
US201514617523 |
申请日期 |
2015.02.09 |
| 申请人 |
Micron Technology, Inc. |
发明人 |
Gibbons Kevin;Reynolds Tracy V.;Corisis David J. |
| 分类号 |
H05K7/02;H05K1/11 |
主分类号 |
H05K7/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A computer module, comprising:
a module substrate having a module material and an aperture extending at least partially into the module material; and a microelectronic package carried by the module substrate, the microelectronic package having a semiconductor die carried by a package substrate, wherein at least a portion of the semiconductor die extends into the substrate material via the aperture. |
| 地址 |
Boise ID US |
