发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device in which both of an IGBT and a diode have a buffer region, and the on-state voltage of the IGBT is low.SOLUTION: A semiconductor device has: a cathode region of a diode; a first buffer region adjacent to the back surface side of a semiconductor substrate with respect to the cathode region; a collector region of an IGBT; and a second buffer region adjacent to the back surface side of the collector region. A method of manufacturing the semiconductor device comprises the steps of: forming a thin portion and a thick portion by forming a step portion on a surface of the semiconductor substrate; and forming a first buffer region and a second buffer region by injecting n-type impurities from surfaces of the thin portion and the thick portion.
申请公布号 JP2015095618(A) 申请公布日期 2015.05.18
申请号 JP20130235779 申请日期 2013.11.14
申请人 TOYOTA MOTOR CORP 发明人 KAMIJO TAKUMA
分类号 H01L29/739;H01L21/329;H01L21/336;H01L27/04;H01L29/78;H01L29/861;H01L29/868 主分类号 H01L29/739
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