| 摘要 |
<p>The invention provides a manufacturing method, which can reduce kinds of masks used in manufacture of an electronic component, of the electronic component. A leading-out conductor layer (20a) and a leading-out conductor layer (20d), the orientation of which differs 180 degrees with the leading-out conductor layer (20a), are formed on a surface of a mother raw sheet (116a). At this time, the leading-out conductor layer (20a) and the leading-out conductor layer (20d) are formed in a manner that a point symmetrical relationship is formed relative to a central point (P) of the surfaces of mother raw sheets (116a, 116d). Similarly, coil conductor layers (18a, 18b) and leading-out conductor layers (20b, 20c) are formed on surfaces of mother raw sheets (116b, 116c). After the mother raw sheets (116c, 116d) rotate 180 degrees taking the central point (P) as a center relative to the mother raw sheets (116a, 116b), the mother raw sheets (116a-116d) are laminated.</p> |
