METHOD AND DEVICE FOR DIVIDING BRITTLE MATERIAL SUBSTRATE

摘要

The present invention has a resin or a surface layer of a metal instead of using a break bar with a sharp knife tip. The present invention provides a method and a device to divide brittle material substrate comprising a surface layer (2) on a top surface of a main substrate (1), and dividing a substrate (W) with a plurality of scribe line (S) on a lower surface of the main substrate (1). The invention places pressure on a break bar (7) to a direction of the scribe line (S) from a top surface of the surface layer (2). The present invention comprises: a main substrate break process of dividing only the main substrate (1) along with the scribe line (S) by bending the substrate (W) to the bottom; and a surface layer dividing process of dividing the surface layer (2) by placing pressure on the pressure material (8) from the main substrate (1) in the direction toward the scribe line (S).