发明名称 SOLDER ALLOY, SOLDER PASTE, AND ELECTRONIC CIRCUIT BOARD
摘要 A SOLDER ALLOY IS A TIN-SILVER-COPPER SOLDER ALLOY CONTAINING TIN, SILVER, COPPER, NICKEL, ANTIMONY, BISMUTH, AND INDIUM, AND SUBSTANTIALLY DOES NOT CONTAIN GERMANIUM, WHEREIN RELATIVE TO THE TOTAL AMOUNT OF THE SOLDER ALLOY, THE SILVER CONTENT IS MORE THAN 0.05 MASS% AND LESS THAN 0.2 MASS%, AND THE ANTIMONY CONTENT IS 0.01 MASS% OR MORE AND LESS THAN 2.5 MASS%.
申请公布号 MY154044(A) 申请公布日期 2015.04.27
申请号 MY2014PI03590 申请日期 2012.11.16
申请人 HARIMA CHEMICALS, INCORPORATED 发明人 YOJI, IMAMURA;KAZUKI, IKEDA;JINYU, PIAO;TADASHI, TAKEMOTO
分类号 B23K35/26 主分类号 B23K35/26
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