| 摘要 |
<p>The present invention addresses the problem of providing a light-curing/heat-curing resin composition with high sensitivity to light and minimal generation of development residue even if the drying time is extended before exposure to light, a hardened material comprising the composition, and a printed circuit board having the hardened material. In order to overcome the problem, an embodiment of the present invention provides a light-curing/heat-curing resin composition characterized in containing: (A) a carboxyl-containing photosensitive resin obtained by reacting a multifunctional epoxy resin and a radical-polymerizable unsaturated monocarboxylic acid to generate an epoxy carboxylate having a side-chain hydroxyl, reacting the epoxy carboxylate with a polybasic acid anhydride to generate a carboxyl-containing photosensitive resin (A1), and reacting the carboxyl-containing photosensitive resin (A1) with a compound having an epoxy group and a radical-polymerizable unsaturated group; (B) a multifunctional epoxy resin having a hardening point no higher than 60°C; and (C) a photopolymerization initiator.</p> |
