METHOD OF MANUFACTURING A WIRING BOARD

摘要

There is provided a method of manufacturing a wiring board, including the steps of: preparing an insulating layer 1a including a cavity formation region X, and a separable metallic foil M formed of first and second metallic foils M1 and M2; allowing the separable metallic foil M to adhere to at least a lower face side of the insulating layer 1a with the first metallic foil M1 serving as an adhering surface; forming a cavity 2 by digging the insulating layer 1a and the separable metallic foil M in a cavity formation region X from an upper surface side of the insulating layer 1a to a depth that does not penetrate the second metallic foil M2; inserting an electronic component D into the cavity 2, and fixing the electronic component D by a fixing resin J; and peeling off the second metallic foil M2.

主权项

1. A method of manufacturing a wiring board, comprising the steps of:
preparing an insulating layer including a cavity formation region and a wiring formation region surrounding the cavity formation region, and a separable metallic foil formed of a first metallic foil and a second metallic foil which are brought into intimate contact with each other in a separable manner; allowing the separable metallic foil to adhere to at least a lower surface side of the insulating layer with the first metallic foil serving as an adhering surface; forming a cavity in the cavity formation region by digging the insulating layer and the separable metallic foil from an upper surface side of the insulating layer to a depth that reaches the second metallic foil on the lower surface side of the insulating layer but does not penetrate the second metallic foil; injecting a fixing resin into the cavity; inserting an electronic component into the cavity into which the fixing resin is injected, and fixing the electronic component by curing the fixing resin; and peeling off the second metallic foil from an intimate contact surface with the first metallic foil.