发明名称 配線基板
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a wiring board which can inhibit decrease in wiring width to less than a predetermined wiring width while sufficiently ensuring electric connection reliability between a columnar electrode and wiring. <P>SOLUTION: The present wiring board is a wiring board in which a plurality of insulation layers and a plurality of wiring layers are laminated. A columnar electrode is installed inside one of the insulation layers having one surface serving as a surface of the wiring board and another surface on the opposite side, and a pad provided on one end of the columnar electrode is exposed on the one surface. On the other surface, a recessed opening part with a bottom surface on which another end of the columnar electrode is exposed is provided, and wiring filling the opening part and connected with the other end of the columnar electrode via the opening is provided. <P>COPYRIGHT: (C)2012,JPO&INPIT</p>
申请公布号 JP5680589(B2) 申请公布日期 2015.03.04
申请号 JP20120142382 申请日期 2012.06.25
申请人 发明人
分类号 H05K1/11;H05K3/18;H05K3/24;H05K3/38 主分类号 H05K1/11
代理机构 代理人
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