Loadport bridge for semiconductor fabrication tools

摘要

A wafer handling system with apparatus for transporting wafers between semiconductor fabrication tools. In one embodiment, the apparatus is a loadport bridge mechanism including an enclosure having first and second mounting ends, a docking port at each end configured and dimensioned to interface with a loadport of a semiconductor tool, and at least one wafer transport robot operable to transport a wafer between the docking ports. The wafer transport robot hands off or receives a wafer to/from a tool robot at the loadports of a first and second tool. The bridge mechanism allows one or more wafers to be transferred between loadports of different tools on an individual basis without reliance on the FAB's automated material handling system (AMHS) for bulk wafer transport inside a wafer carrier such as a FOUP or others.

主权项

1. A wafer handling system for a semiconductor fabrication facility (FAB), comprising:
a first semiconductor tool having a plurality of loadports including a first loadport, each of the plurality of loadports having a single respective tool access door and being configured for receiving a first wafer carrier operable to hold a plurality of wafers; a second semiconductor tool having a plurality of loadports including a second loadport, each of the plurality of loadports having a single respective tool access door and being configured for receiving a second wafer carrier operable to hold a plurality of wafers; and a loadport bridge mechanism spanning between the first and second loadports, the loadport bridge mechanism including wafer transport robot configured and operable to transport a wafer outside a wafer carrier from the respective tool access door of the first loadport of the first semiconductor tool to the respective tool access door of the second loadport of the second semiconductor tool.