| 发明名称 |
BURN-IN SOCKET WITH A HEAT SINK |
| 摘要 |
An burn-in socket electrically connecting an IC package to a PCB, comprises a base, a cover, a plurality of contacts and a block-shaped heat sink. The base defines a receiving space for the IC package. The cover is pin-jointed to one side by a pivot of the base and able to rotate around the pivot. A plurality of contacts are retained in the base and partially exposed in the receiving space. The heat sink is located above the IC package and against to the IC package so as to apply its gravity force to the IC package. Top face of the heat sink is below top face of the cover. |
| 申请公布号 |
US2014375345(A1) |
申请公布日期 |
2014.12.25 |
| 申请号 |
US201414312631 |
申请日期 |
2014.06.23 |
| 申请人 |
HON HAI PRECISION INDUSTRY CO., LTD. |
发明人 |
LIN WEI-CHIH |
| 分类号 |
G01R31/28 |
主分类号 |
G01R31/28 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A bum-in socket electrically connecting an IC package to a PCB, comprising:
a base defining a receiving space for the IC package; a cover pin-jointed to one side by a pivot of the base and able to rotate around the pivot; a plurality of contacts retained in the base and partially exposed to the receiving space; a block-shaped heat sink located above the IC package and abutting against the IC package so as to apply a gravity force to the IC package; wherein top face of the heat sink is below a top face of the cover. |
| 地址 |
New Taipei TW |
